Description
This compact heatsink with integrated fan provides sufficient cooling even in applications without airflow or where space is limited. The fan receives its current via the module interface of the controller. This fan is a very high quality model of the company. Sepa that can also be used in 3D flight. Its cooling performance is very good and the combination of heatsink and fan ensures optimal heat dissipation. The fan is glued on by means of the included thermal pad.